Temporary Bonding Adhesives Market

Gain valuable insights into the market for Temporary Bonding Adhesives, including sales outlook, demand forecast, and up-to-date key trends

Enabling Advanced Semiconductor Manufacturing Processes

Category: Chemicals & Materials

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ID: CVC-49336

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Format: PDF+Excel Dataset

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Published Date: Feb-23

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Pages: 275

Report Highlights

According to a research survey conducted by ChemView Consulting, Temporary Bonding Adhesives Market is estimated to be worth US$ 1.53 Bn in 2023. The market is expected to grow at a CAGR of 5.60 % between 2023 and 2033 to hit US$ 2.65 Bn by 2033 end.

Key Market Trends

Increased Adoption of Water-Soluble Temporary Bonding Adhesives

As environmental concerns continue to rise, the temporary bonding adhesive market is seeing a shift towards more sustainable solutions. Water-soluble temporary bonding adhesives are gaining popularity due to their biodegradability and low VOC emissions. Manufacturers who develop and promote such eco-friendly adhesives have a competitive advantage in the market. By emphasizing the benefits of water-soluble adhesives, companies can attract environmentally conscious customers and make a positive impact on the environment.

Rising Demand for UV-Curable Temporary Bonding Adhesives

With the increasing demand for high-performance and efficient bonding solutions, UV-curable temporary bonding adhesives are becoming more popular. These adhesives provide fast and strong bonding capabilities without the need for heat or solvents. They are ideal for a wide range of applications, from electronic devices to automotive manufacturing. Manufacturers who invest in UV-curable adhesives can take advantage of this trend and differentiate themselves from competitors. By highlighting the benefits of fast curing times and superior performance, companies can attract customers who require reliable and efficient bonding solutions.

Market Drivers

Rising Demand for Consumer Electronics and Miniaturization of Electronic Devices to Boost the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is driven by the increasing demand for consumer electronics, which has led to the miniaturization of electronic devices. As electronic devices become smaller and more complex, the need for temporary bonding adhesives that can hold multiple layers of components together during the manufacturing process becomes more important.

The rise of the Internet of Things (IoT) and the adoption of smart home devices are also expected to drive the demand for temporary bonding adhesives. These devices require small and complex electronic components that need to be assembled in a precise and efficient manner, which can be achieved with the use of temporary bonding adhesives.

Growing Use of Renewable Energy to Drive the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is also driven by the growing use of renewable energy. The production of solar panels, wind turbines, and other renewable energy technologies requires the use of semiconductors and microchips, which are held together using temporary bonding adhesives. Government initiatives and funding are expected to drive the Asia Pacific temporary bonding adhesives market’s growth. Many countries in the region have launched several initiatives to boost their semiconductor and electronics industries, which are the primary users of temporary bonding adhesives. For instance, the Indian government launched the Electronics Manufacturing Cluster (EMC) scheme to attract investment in the electronics sector.

Segmentation Insights

After conducting a thorough analysis of the Temporary Bonding Adhesives Market, we have identified the top three trending segments in the industry. These segments are experiencing high demand, strong market growth, and widespread adoption.

Most Popular (Fastest Growth Rate)

Silicones – Semiconductor Industry

Silicones have emerged as the most popular choice in the Temporary Bonding Adhesives Market for the Semiconductor Industry. These adhesives provide excellent adhesion and have the ability to withstand high-temperature processes, making them ideal for temporary bonding in semiconductor applications. The high reliability and performance of silicones make them the preferred choice for consumers seeking efficient and effective temporary bonding solutions in the semiconductor industry.

Most Selling (Largest Market Share)

Thermoplastics – 3D Integrated Circuits

Thermoplastics are the most selling product in the Temporary Bonding Adhesives Market for 3D Integrated Circuits. These adhesives offer excellent bonding properties, good chemical resistance, and easy processing capabilities, making them ideal for temporary bonding in 3D integrated circuits. The high performance and compatibility of thermoplastics make them the go-to choice for consumers seeking reliable and effective temporary bonding solutions in 3D integrated circuits.

Trending (Gaining Traction)

Modified Epoxy – CMOS Image Sensors

Modified Epoxy adhesives are gaining significant traction in the Temporary Bonding Adhesives Market for CMOS Image Sensors. These adhesives offer excellent bonding strength, thermal stability, and chemical resistance, making them ideal for temporary bonding in CMOS image sensor manufacturing. The exceptional performance and high-quality results of modified epoxy adhesives make them the trending choice for consumers seeking reliable and effective temporary bonding solutions in CMOS image sensors.

Regional Insights

Growing Trend of Automation in Manufacturing Drives the Temporary Bonding Adhesives Market in North America

The temporary bonding adhesives market in North America is witnessing significant growth due to the increasing trend of automation in manufacturing. Automation has become a key factor in the manufacturing industry, and temporary bonding adhesives are widely used in the production of automated systems.

Asia: A Growing Market with Expanding Electronics Industries

The Asian market, including countries like China, India, and Japan, is witnessing rapid growth in the temporary bonding adhesives market. The region’s expanding electronics industries and increasing demand for high-quality temporary bonding adhesives in various applications have contributed to the rising demand for temporary bonding adhesives. The increasing focus on product development and the cost-competitive advantages of the region make Asia an attractive market for temporary bonding adhesives manufacturers and investors.

Research Scope/Taxonomy
Market Analysis by Material Type:

  • Wax
  • Silicones
  • Thermoplastics
  • Modified Epoxy
  • Others

Market Analysis by Application:

  • Semiconductor
  • 3D Integrated Circuits
  • CMOS Image Sensors
  • Light-emitting Diodes (LED)
  • Memory and Logic Chips
  • Others
  • Manufacturing
  • Other Industrial

Key Companies Profiled

  • 3M Company
  • Henkel Corporation
  • AI Technology, Inc
  • SUSS MicroTec
  • Brewer Science, Inc.
  • Dow Chemical Company
  • Thin Materials AG
  • I. du Pont de Nemours and Company (DuPont)
  • Nitto Denko
  • Valtech Corporation

1. Executive Summary
1.1. Global Market Snapshot
1.2. Key Success Factors
1.3. Strategic Analysis and Recommendations
2. Market Overview
2.1. Market Taxonomy
2.2. Market Definitions
3. Research Methodology
3.1. Preliminary Investigation & Research Design
3.2. Secondary Research & Primary Research
3.3. Data Analysis & Econometric Modelling
3.4. Expert Data Validation
4. Key Emerging Trends Analysis
4.1. Supply-Side Trends
4.2. Demand-Side Trends
5. Global Temporary Bonding Adhesives Market Value (US$ Mn) and Volume (Tons) Analysis
5.1. Global Market Value (US$ Mn) Analysis, 2017 – 2032
5.2. Incremental $ Opportunity Index, 2022-2032
5.3. Global Market Volume (Tons) Analysis, 2017 – 2032
6. Global Temporary Bonding Adhesives Market Pricing Analysis
6.1. Regional Level Pricing Analysis and Forecast
6.1.1. Manufacturers Level Pricing
6.1.2. Distributor Level Pricing
6.2. Global Pricing Analysis Benchmark
6.3. Cost Breakdown Analysis
7. Cross-Sectional Analysis
7.1. Cross Analysis of Type W.R.T. Application
8. Supply Vs. Demand Analysis
8.1. Regional Supply Vs. Demand Gap Assessment
8.2. Top Producing Countries Analysis
9. Market Background
9.1. Macroeconomic Factors
9.2. Forecast Factors
9.3. Market Dynamics
9.3.1. Driver
9.3.2. Restraint
9.3.3. Opportunity
9.4. Supply Chain Analysis
9.4.1. List Raw Material Suppliers
9.4.2. List of Manufacturers
9.4.3. List of Distributors
9.4.4. List of End-Users
9.4.5. End-Users Consumption Analysis
9.4.6. Average Profitability Margin Analysis
9.5. Covid-19 Impact Assessment
9.5.1. Economy/Cluster Projections
9.5.2. Covid-19 Economic Assessment
9.5.3. Impact on Target Market
9.5.4. Recovery Scenario
9.6. Regulatory Framework
9.6.1. Regulations of Key Countries
9.6.2. Potential Impact of Regulations
9.7. Porter’s Five Forces Analysis
9.8. Technology Landscape
10. Global Temporary Bonding Adhesives Market 2017 – 2032 By Material Type
10.1. Introduction
10.2. Key Market Trends
10.3. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Material Type [Value (US$ Mn) and Volume (Tons) Analysis]
10.3.1. Wax
10.3.2. Silicones
10.3.3. Thermoplastics
10.3.4. Modified Epoxy
10.3.5. Others
10.4. Market Attractiveness Analysis by Material Type
11. Global Temporary Bonding Adhesives Market 2017 – 2032 by Application
11.1. Introduction
11.2. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Application [Value (US$ Mn) and Volume (Tons) Analysis]
11.2.1. Semiconductor
11.2.2. 3D Integrated Circuits
11.2.3. CMOS Image Sensors
11.2.4. Light-emitting Diodes (LED)
11.2.5. Memory and Logic Chips
11.2.6. Others
11.2.7. Manufacturing
11.2.8. Other Industrial
11.3. Market Attractiveness Analysis by Application
12. Global Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032 by Region
12.1. Introduction
12.2. Key Market Trends
12.3. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Region [Value (US$ Mn) and Volume (Tons) Analysis]
12.3.1. North America
12.3.2. Latin America
12.3.3. Europe
12.3.4. Asia-Pacific
12.3.5. Middle East
12.3.6. Africa
12.4. Market Attractiveness Analysis by Region
13. North America Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2022-2033
13.1. Introduction
13.2. Key Market Trends
13.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
13.3.1. By Country
13.3.1.1. U.S.
13.3.1.2. Canada
13.3.2. By Material Type
13.3.3. By Application
13.4. Market Attractiveness Analysis
13.4.1. By Country
13.4.2. By Material Type
13.4.3. By Application
14. Latin America Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032
14.1. Introduction
14.2. Key Market Trends
14.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
14.3.1. By Country
14.3.1.1. Brazil
14.3.1.2. Mexico
14.3.1.3. Rest of Latin America
14.3.2. By Material Type
14.3.3. By Application
14.4. Market Attractiveness Analysis
14.4.1. By Country
14.4.2. By Material Type
14.4.3. By Application
15. Europe Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032
15.1. Introduction
15.2. Key Market Trends
15.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
15.3.1. By Country
15.3.1.1. Germany
15.3.1.2. Italy
15.3.1.3. France
15.3.1.4. UK
15.3.1.5. Spain
15.3.1.6. Netherlands
15.3.1.7. Norway
15.3.1.8. Russia
15.3.1.9. Rest of Europe
15.3.2. By Material Type
15.3.3. By Application
15.4. Market Attractiveness Analysis
15.4.1. By Country
15.4.2. By Material Type
15.4.3. By Application
16. Asia-Pacific Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032
16.1. Introduction
16.2. Key Market Trends
16.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
16.3.1. By Country
16.3.1.1. China
16.3.1.2. Japan
16.3.1.3. South Korea
16.3.1.4. India
16.3.1.5. Indonesia
16.3.1.6. Thailand
16.3.1.7. Vietnam
16.3.1.8. Australia & New Zealand
16.3.1.9. Rest of Asia-Pacific
16.3.2. By Material Type
16.3.3. By Application
16.4. Market Attractiveness Analysis
16.4.1. By Country
16.4.2. By Material Type
16.4.3. By Application
17. Middle East Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032
17.1. Introduction
17.2. Key Market Trends
17.3. Pricing Analysis
17.4. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
17.4.1. By Country
17.4.1.1. Saudi Arabia
17.4.1.2. Turkey
17.4.1.3. U.A.E.
17.4.1.4. Rest of the Middle East
17.4.2. By Material Type
17.4.3. By Application
17.5. Market Attractiveness Analysis
17.5.1. By Country
17.5.2. By Material Type
17.5.3. By Application
18. Africa Temporary Bonding Adhesives Market Historical Analysis 2017 – 2021 and Forecast 2017 – 2032
18.1. Introduction
18.2. Key Market Trends
18.3. Pricing Analysis
18.4. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]
18.4.1. By Country
18.4.1.1. South Africa
18.4.1.2. Nigeria
18.4.1.3. Egypt
18.4.1.4. Rest of Africa
18.4.2. By Material Type
18.4.3. By Application
18.5. Market Attractiveness Analysis
18.5.1. By Country
18.5.2. By Material Type
18.5.3. By Application
19. Competition Analysis
19.1. Tier Structure Breakdown
19.2. Market Share Analysis
19.3. Material Type Capacity Analysis
19.4. Company Footprint Analysis
19.4.1. Product Footprint of Players
19.4.2. Regional Footprint of Players
19.4.3. Channel Footprint of Players
19.5. Brand Preference Analysis
19.6. Competition Dashboard
20. Company Profiles
20.1. 3M Company.
20.1.1. Company Overview
20.1.2. Product & Financial Portfolio
20.1.3. Manufacturing Facilities
20.1.4. Recent Developments
20.1.5. SWOT Analysis
20.1.6. Strategy Overview
20.2. Henkel Corporation
20.3. AI Technology, Inc
20.4. SUSS MicroTec
20.5. Brewer Science, Inc.
20.6. Dow Chemical Company
20.7. Thin Materials AG
20.8. I. du Pont de Nemours and Company (DuPont)
20.9. Nitto Denko
20.10. Valtech Corporation
21. Assumptions and Acronyms

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