Temporary Bonding Adhesives Market

Gain valuable insights into the market for Temporary Bonding Adhesives, including sales outlook, demand forecast, and up-to-date key trends

Enabling Advanced Semiconductor Manufacturing Processes

Category: Chemicals & Materials Published Date : Feb-23 ID: CVC-49336 Format: PDF Pages: 275

Report Highlights

According to a research survey conducted by ChemView Consulting, Temporary Bonding Adhesives Market is estimated to be worth US$ 1.53 Bn in 2023. The market is expected to grow at a CAGR of 5.60 % between 2023 and 2033 to hit US$ 2.65 Bn by 2033 end.

Key Market Trends

Increased Adoption of Water-Soluble Temporary Bonding Adhesives

As environmental concerns continue to rise, the temporary bonding adhesive market is seeing a shift towards more sustainable solutions. Water-soluble temporary bonding adhesives are gaining popularity due to their biodegradability and low VOC emissions. Manufacturers who develop and promote such eco-friendly adhesives have a competitive advantage in the market. By emphasizing the benefits of water-soluble adhesives, companies can attract environmentally conscious customers and make a positive impact on the environment.

Rising Demand for UV-Curable Temporary Bonding Adhesives

With the increasing demand for high-performance and efficient bonding solutions, UV-curable temporary bonding adhesives are becoming more popular. These adhesives provide fast and strong bonding capabilities without the need for heat or solvents. They are ideal for a wide range of applications, from electronic devices to automotive manufacturing. Manufacturers who invest in UV-curable adhesives can take advantage of this trend and differentiate themselves from competitors. By highlighting the benefits of fast curing times and superior performance, companies can attract customers who require reliable and efficient bonding solutions.

Market Drivers

Rising Demand for Consumer Electronics and Miniaturization of Electronic Devices to Boost the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is driven by the increasing demand for consumer electronics, which has led to the miniaturization of electronic devices. As electronic devices become smaller and more complex, the need for temporary bonding adhesives that can hold multiple layers of components together during the manufacturing process becomes more important.

The rise of the Internet of Things (IoT) and the adoption of smart home devices are also expected to drive the demand for temporary bonding adhesives. These devices require small and complex electronic components that need to be assembled in a precise and efficient manner, which can be achieved with the use of temporary bonding adhesives.

Growing Use of Renewable Energy to Drive the Temporary Bonding Adhesives Market

The temporary bonding adhesives market is also driven by the growing use of renewable energy. The production of solar panels, wind turbines, and other renewable energy technologies requires the use of semiconductors and microchips, which are held together using temporary bonding adhesives. Government initiatives and funding are expected to drive the Asia Pacific temporary bonding adhesives market’s growth. Many countries in the region have launched several initiatives to boost their semiconductor and electronics industries, which are the primary users of temporary bonding adhesives. For instance, the Indian government launched the Electronics Manufacturing Cluster (EMC) scheme to attract investment in the electronics sector.

Segmentation Insights

After conducting a thorough analysis of the Temporary Bonding Adhesives Market, we have identified the top three trending segments in the industry. These segments are experiencing high demand, strong market growth, and widespread adoption.

Most Popular (Fastest Growth Rate)

Silicones – Semiconductor Industry

Silicones have emerged as the most popular choice in the Temporary Bonding Adhesives Market for the Semiconductor Industry. These adhesives provide excellent adhesion and have the ability to withstand high-temperature processes, making them ideal for temporary bonding in semiconductor applications. The high reliability and performance of silicones make them the preferred choice for consumers seeking efficient and effective temporary bonding solutions in the semiconductor industry.

Most Selling (Largest Market Share)

Thermoplastics – 3D Integrated Circuits

Thermoplastics are the most selling product in the Temporary Bonding Adhesives Market for 3D Integrated Circuits. These adhesives offer excellent bonding properties, good chemical resistance, and easy processing capabilities, making them ideal for temporary bonding in 3D integrated circuits. The high performance and compatibility of thermoplastics make them the go-to choice for consumers seeking reliable and effective temporary bonding solutions in 3D integrated circuits.

Trending (Gaining Traction)

Modified Epoxy – CMOS Image Sensors

Modified Epoxy adhesives are gaining significant traction in the Temporary Bonding Adhesives Market for CMOS Image Sensors. These adhesives offer excellent bonding strength, thermal stability, and chemical resistance, making them ideal for temporary bonding in CMOS image sensor manufacturing. The exceptional performance and high-quality results of modified epoxy adhesives make them the trending choice for consumers seeking reliable and effective temporary bonding solutions in CMOS image sensors.

Regional Insights

Growing Trend of Automation in Manufacturing Drives the Temporary Bonding Adhesives Market in North America

The temporary bonding adhesives market in North America is witnessing significant growth due to the increasing trend of automation in manufacturing. Automation has become a key factor in the manufacturing industry, and temporary bonding adhesives are widely used in the production of automated systems.

Asia: A Growing Market with Expanding Electronics Industries

The Asian market, including countries like China, India, and Japan, is witnessing rapid growth in the temporary bonding adhesives market. The region’s expanding electronics industries and increasing demand for high-quality temporary bonding adhesives in various applications have contributed to the rising demand for temporary bonding adhesives. The increasing focus on product development and the cost-competitive advantages of the region make Asia an attractive market for temporary bonding adhesives manufacturers and investors.

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Report Includes

Research Scope/Taxonomy
Market Analysis by Material Type:

  • Wax
  • Silicones
  • Thermoplastics
  • Modified Epoxy
  • Others

Market Analysis by Application:

  • Semiconductor
  • 3D Integrated Circuits
  • CMOS Image Sensors
  • Light-emitting Diodes (LED)
  • Memory and Logic Chips
  • Others
  • Manufacturing
  • Other Industrial

Analyst Credentials

Key Companies Profiled

  • 3M Company
  • Henkel Corporation
  • AI Technology, Inc
  • SUSS MicroTec
  • Brewer Science, Inc.
  • Dow Chemical Company
  • Thin Materials AG
  • I. du Pont de Nemours and Company (DuPont)
  • Nitto Denko
  • Valtech Corporation

1.1. Global Market Snapshot

1.2. Key Success Factors

1.3. Strategic Analysis and Recommendations

2.1. Market Taxonomy

2.2. Market Definitions

3.1. Preliminary Investigation & Research Design

3.2. Secondary Research & Primary Research

3.3. Data Analysis & Econometric Modelling

3.4. Expert Data Validation

4.1. Supply-Side Trends

4.2. Demand-Side Trends

5.1. Global Market Value (US$ Mn) Analysis, 2017 – 2032

5.2. Incremental $ Opportunity Index, 2022-2032

5.3. Global Market Volume (Tons) Analysis, 2017 – 2032

6.1. Regional Level Pricing Analysis and Forecast

6.1.1. Manufacturers Level Pricing

6.1.2. Distributor Level Pricing

6.2. Global Pricing Analysis Benchmark

6.3. Cost Breakdown Analysis

7.1. Cross Analysis of Type W.R.T. Application

8.1. Regional Supply Vs. Demand Gap Assessment

8.2. Top Producing Countries Analysis

9.1. Macroeconomic Factors

9.2. Forecast Factors

9.3. Market Dynamics

9.3.1. Driver

9.3.2. Restraint

9.3.3. Opportunity

9.4. Supply Chain Analysis

9.4.1. List Raw Material Suppliers

9.4.2. List of Manufacturers

9.4.3. List of Distributors

9.4.4. List of End-Users

9.4.5. End-Users Consumption Analysis

9.4.6. Average Profitability Margin Analysis

9.5. Covid-19 Impact Assessment

9.5.1. Economy/Cluster Projections

9.5.2. Covid-19 Economic Assessment

9.5.3. Impact on Target Market

9.5.4. Recovery Scenario

9.6. Regulatory Framework

9.6.1. Regulations of Key Countries

9.6.2. Potential Impact of Regulations

9.7. Porter’s Five Forces Analysis

9.8. Technology Landscape

10.1. Introduction

10.2. Key Market Trends

10.3. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Material Type [Value (US$ Mn) and Volume (Tons) Analysis]

10.3.1. Wax

10.3.2. Silicones

10.3.3. Thermoplastics

10.3.4. Modified Epoxy

10.3.5. Others

10.4. Market Attractiveness Analysis by Material Type

11.1. Introduction

11.2. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Application [Value (US$ Mn) and Volume (Tons) Analysis]

11.2.1. Semiconductor

11.2.2. 3D Integrated Circuits

11.2.3. CMOS Image Sensors

11.2.4. Light-emitting Diodes (LED)

11.2.5. Memory and Logic Chips

11.2.6. Others

11.2.7. Manufacturing

11.2.8. Other Industrial

11.3. Market Attractiveness Analysis by Application

12.1. Introduction

12.2. Key Market Trends

12.3. Historical and Current Market (2017-2021) and Future Market Analysis (2022-2032) By Region [Value (US$ Mn) and Volume (Tons) Analysis]

12.3.1. North America

12.3.2. Latin America

12.3.3. Europe

12.3.4. Asia-Pacific

12.3.5. Middle East

12.3.6. Africa

12.4. Market Attractiveness Analysis by Region

13.1. Introduction

13.2. Key Market Trends

13.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

13.3.1. By Country U.S. Canada

13.3.2. By Material Type

13.3.3. By Application

13.4. Market Attractiveness Analysis

13.4.1. By Country

13.4.2. By Material Type

13.4.3. By Application

14.1. Introduction

14.2. Key Market Trends

14.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

14.3.1. By Country Brazil Mexico Rest of Latin America

14.3.2. By Material Type

14.3.3. By Application

14.4. Market Attractiveness Analysis

14.4.1. By Country

14.4.2. By Material Type

14.4.3. By Application

15.1. Introduction

15.2. Key Market Trends

15.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

15.3.1. By Country Germany Italy France UK Spain Netherlands Norway Russia Rest of Europe

15.3.2. By Material Type

15.3.3. By Application

15.4. Market Attractiveness Analysis

15.4.1. By Country

15.4.2. By Material Type

15.4.3. By Application

16.1. Introduction

16.2. Key Market Trends

16.3. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

16.3.1. By Country China Japan South Korea India Indonesia Thailand Vietnam Australia & New Zealand Rest of Asia-Pacific

16.3.2. By Material Type

16.3.3. By Application

16.4. Market Attractiveness Analysis

16.4.1. By Country

16.4.2. By Material Type

16.4.3. By Application

17.1. Introduction

17.2. Key Market Trends

17.3. Pricing Analysis

17.4. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

17.4.1. By Country Saudi Arabia Turkey U.A.E. Rest of the Middle East

17.4.2. By Material Type

17.4.3. By Application

17.5. Market Attractiveness Analysis

17.5.1. By Country

17.5.2. By Material Type

17.5.3. By Application

18.1. Introduction

18.2. Key Market Trends

18.3. Pricing Analysis

18.4. Historical and Current Market Size (2017-2021) and Future Market Size Analysis (2022-2032) [Value (US$ Mn) and Volume (Tons) Analysis]

18.4.1. By Country South Africa Nigeria Egypt Rest of Africa

18.4.2. By Material Type

18.4.3. By Application

18.5. Market Attractiveness Analysis

18.5.1. By Country

18.5.2. By Material Type

18.5.3. By Application

19.1. Tier Structure Breakdown

19.2. Market Share Analysis

19.3. Material Type Capacity Analysis

19.4. Company Footprint Analysis

19.4.1. Product Footprint of Players

19.4.2. Regional Footprint of Players

19.4.3. Channel Footprint of Players

19.5. Brand Preference Analysis

19.6. Competition Dashboard

20.1. 3M Company.

20.1.1. Company Overview

20.1.2. Product & Financial Portfolio

20.1.3. Manufacturing Facilities

20.1.4. Recent Developments

20.1.5. SWOT Analysis

20.1.6. Strategy Overview

20.2. Henkel Corporation

20.3. AI Technology, Inc

20.4. SUSS MicroTec

20.5. Brewer Science, Inc.

20.6. Dow Chemical Company

20.7. Thin Materials AG

20.8. I. du Pont de Nemours and Company (DuPont)

20.9. Nitto Denko

20.10. Valtech Corporation